a doc. no : qw0905- rev. : date : 13 - aug.- 2007 LPG3330-PF data sheet LPG3330-PF round type led lamps lead-free parts ligitek electronics co.,ltd. property of ligitek only pb
25.0min ? 0.5 typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 1.0min 2.54typ + - 1.5max package dimensions part no.LPG3330-PF ligitek electronics co.,ltd. property of ligitek only 5.9 7.6 8.6 1/5 5.0 page
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 100 -40 ~ +100 -40 ~ +85 ir 10 ratings pg 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 28 viewing angle 2 1/2 (deg) min. 8.0 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 555 spectral halfwidth nm 30 typ. luminous intensity @10ma(mcd) 20 emitted green part no LPG3330-PF material gap lens color green diffused LPG3330-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 pg chip fig.6 directive radiation 4.0 page3/5 LPG3330-PF part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 0 50 100 preheat 2 /sec max 25 120 150 time(sec) temp( c) 260 5 /sec max 260 c3sec max ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 4/5 LPG3330-PF part no.
1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec high temperature high humidity test thermal shock test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this test is the resistance of the device under tropical for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only description test condition test item high temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: reference standard page 5/5 LPG3330-PF part no.
|
